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Koch Chemie Polishing Foam Pad Kit

Original price was: $44.85.Current price is: $35.88.

SKU: KC-FPK6 Category:

Description

Koch Chemie Polishing Foam Pad Kit

Koch Chemie Heavy Cut Pad

Koch-Chemie’s HEAVY CUT PAD is an abrasive sponge for removing strong weathering and deep scratches. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high level of abrasiveness and excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.

  • Compression Hardness: 17
  • Abrasiveness: 9
  • Recommended Compound: Koch-Chemie’s HEAVY CUT H9.01 Polishing Compound

Koch Chemie Fine Cut Pad

Medium abrasive sponge for removing moderate weathering and scratches. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contributes to a high level of abrasiveness and excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety.

  • Compression Hardness: 12
  • Abrasiveness: 5
  • Recommended Compound: Koch-Chemie’s FINE CUT F6.01 Polishing Compound

Koch Chemie Micro Cut Pad

High-quality special sponge for removing fine scratches, holograms and polishing marks. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.

  • Compression Hardness: 10
  • Abrasiveness: 5
  • Recommended Compounds: Koch-Chemie’s MICRO CUT M3.02

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